FAQ

Cleaning

1.special are shall be taken when applying the chemicals listed below for cleaning because certain chemicals may damage the surface of lens or case and cause discoloration.

Solvent Adaptability
Ethyl alcohol, Isopropyl alcohol o
Trichloroethylene,Chlorothene Acetone, Thinner x

2.Dipping time:2minutes max. at normal temperature

Forming

1.The lead frame should be bent at a point 2mm away from the body resin.

2.Bending should be performed with the base firmly Fixed by means of a jig or radio pliers.

3. Lead forming should be performed prior to soldering.

4.Avoid applying any stress to resin in order to prevent the epoxy fracture and break on bonding wire.

5.Avoid Forming the lead Frame at the same point twice or more.

Soldering

1.Be sure not to mount LEDs in conditions where excessive stress is applied to lead frames.

2.The mounting direction of the flat package type LED electrodes is perpendicular to the direction of the board curve.

3.JIAMING will not guarantee LEDs mounted directly on the board because the resin bodies may be damaged by the applied force from board-warping, lead-cutting or clinching when being soldered.(It is strongly recommended that this should be carried out after very careful preparation.)

4.Care should be taken to avoid any shock or vibration to the LED resin body after it has been soldered until the temper-ature of the LED has returned to normal.

5.Conditions

Types Soldering iron Dip soldering Reflow soldering
lamps/flat packages
Temperature at tip of iron:
300℃max .(300 w max.)
Soldering time:
3 sec. max.
Location:
At least 3 mm away from resin body
Pre-heating:
100℃ max. (Resin surface temperature) 60 sec. Max.
Bath temperature:
260+/-5℃(small package:240+/-5℃)
Dipping time:5 sec. Max.
Location:
At least 3.0 mm away from resin body
Not recommended
Alphanumeric displays
Temperature at tip of iron:
300℃max .(300 w max.)
Soldering time:
3 sec. max.
Location:
At least 3 mm away from body resin
Pre-heating:
80℃ max.(Resin surface temperature) 60 sec. Max.
Bath temperature:
260+/-5℃(small package:240+/-5℃)
Dipping time:5 sec. Max.
Location:
At least 2.6 mm away from resin body
Not recommended