Your Place: Home-->Product : Led Home---LED LAMPS FAQ

LED LAMPS FAQ

Cleaning
1.special are shall be taken when applying the chemicals listed below for cleaning because certain chemicals may damage the surface of lens or case and cause discoloration.
Solvent Adaptability
Ethyl alcohol, Isopropyl alcohol o
Trichloroethylene,Chlorothene
Acetone, Thinner
x
2.Dipping time:2minutes max. at normal temperature

b1.jpg (14246 bytes)

Forming
1.The lead frame should be bent at a point 2mm away from the body resin.

b2.jpg (7083 bytes)

b3.jpg (7007 bytes)

2.Bending should be performed with the base firmly Fixed by means of a jig or radio pliers.

b4.jpg (7215 bytes)

b5.jpg (7720 bytes)
3. Lead forming should be performed prior to soldering. 
4.Avoid applying any stress to resin in order to prevent the epoxy fracture and break on bonding wire.
5.Avoid Forming the lead Frame at the same point twice or more.
Soldering
1.Be sure not to mount LEDs in conditions where excessive stress is applied to lead frames.
b6.jpg (10993 bytes) b7.jpg (8945 bytes)
2.The mounting direction of the flat package type LED electrodes is perpendicular to the direction of the board curve.

b8.jpg (11618 bytes)

b9.jpg (11429 bytes)
3.JIAMING will not guarantee LEDs mounted directly on the board because the resin bodies may be damaged by the applied force from board-warping, lead-cutting or clinching when being soldered.(It is strongly recommended that this should be carried out after very careful preparation.)
4.Care should be taken to avoid any shock or vibration to the LED resin body after it has been soldered until the temper-ature of the LED has returned to normal.
5.Conditions
Types Soldering iron Dip soldering Reflow soldering

lamps/flat packages

b10.jpg (7293 bytes)

b11.jpg (7001 bytes)b12.jpg (6651 bytes)

Temperature at tip of iron:
     300íŠmax .(300 w max.)
Soldering time:
     3 sec. max.
Location:
      At least 3 mm away from resin body
Pre-heating:
    100íŠ max. (Resin surface temperature) 60 sec. Max.
Bath temperature:     260+/-5íŠ
     (small package:240+/-5íŠ)
Dipping time:    5 sec. Max.
Location:
      At least 3.0 mm away from resin body

Not
recommended

Alphanumeric displays

b13.jpg (8192 bytes)

b14.jpg (8492 bytes)
Temperature at tip of iron:
      300íŠ max(300 w max.)
Soldering time:
      3 sec. Max.
Location:
      At least 3 mm away from body resin
Pre-heating:
      80íŠ max. (Resin surface temperature) 60 sec. Max.
Bath temperature:  260+/-5íŠ
    (small package: 240+/-5íŠ)
Dipping time:   5 sec. max.
Location:
   At least 2.6 mm away from resin body

Not
recommended